1. J. Chae and K. Jain, Material Assisted Laser Ablation, U.S. Pat. pending.

2. K. Jain and J. Chae, High-Throughput, Low-Cost, Dual-Mode Patterning Methods for Large-Area Substrates, U.S. Pat. pending.

3. K. Jain and U. Reddy, Complex Micro and Nanoscale Fabrication Methods, Structures, and Devices, U.S. Pat. pending.

4. K. Jain and U. Reddy, Methods for Making Nanoscale Dual Damascene Profiles and Devices Made by Same, U.S. Pat. pending.

5. S. Das, J. Halloran and K. Jain, Large-Area Maskless Photopolymerization, U.S. Pat. pending.

6. K. Jain, W. Sweatt and M. Zemel, Spatial Light Modulator Array with Heat Minimization and Image Enhancement Features, U.S. Pat. 7,170,669, issued Jan. 20, 2007.

7. M. Klosner and K. Jain, Versatile Maskless Lithography System with Multiple Resolutions, U.S. Pat. 7,164,465, issued Jan. 16, 2007.

8. K. Jain, Photonic-Electronic Circuit Boards, U.S. Pat. 7,139,448, issued Nov. 21, 2006.

Photonics, Microelectronics, and Microsystems Laboratory
Department of Electrical and Computer Engineering
University of Illinois at Urbana-Champaign