1. J. Chae and K. Jain, Excimer laser projection photoablation patterning of metal thin films for fabrication of microelectronic devices and displays, IEEE Photonics Technology Letters, Vol. 20, p. 1216 (2008).

2. J. Chae, X. Ho, J. Rogers and K. Jain, Patterning of single walled carbon nanotubes using a low-fluence excimer laser photoablation process, Appl. Phys. Lett., Vol. 92, 173115 (2008).

3. J. Chae, S. Appasamy and K. Jain, Excimer Laser projection photoablation and lift-off process for patterning of indium tin oxide for cost-effective fabrication of flat-panel displays, Proc. SPIE, Vol. 6911, p. 69110P-1 (2008), invited paper.

4. J. Chae, S. Appasamy and K. Jain, Patterning of indium tin oxide by projection photoablation and lift-off process for fabrication of flat-panel displays, Appl. Phys. Lett., Vol. 90, p. 261102 (2007).

5. S.-J. Park, J. G. Eden, K. Jain and M. Klosner, Flexible arrays of Ni/polyimide/Cu microplasma devices with a dielectric barrier and excimer laser ablated microcavities, Jpn. J. Appl. Phys., Vol. 45, No. 10B, p. 8221-4 (2006).

6. K. Jain, M. Klosner, M. Zemel and S. Raghunandan, Flexible electronics and displays: High-resolution, roll-to-roll, projection lithography and photoablation processing technologies for high-throughput production, Proc. IEEE, Vol. 93(8), 1500 (2005), invited paper.

7. M. Klosner and K. Jain, Massively parallel, large-area maskless lithography, Appl. Phys. Lett., Vol. 84(15), 2880 (2004).

Photonics, Microelectronics, and Microsystems Laboratory
Department of Electrical and Computer Engineering
University of Illinois at Urbana-Champaign